Copper Tungsten Thermal Properties

Typically they are malleable and ductile deforming under stress without cleaving.

Copper tungsten thermal properties.

Very good thermal conductivity. Tungsten copper alloy is also called copper tungsten alloy consists of w and cu owns properties of heat resistant high density low thermal expansivity and high electrical conductivity which has been widely used as electrode contacts and heat sink materials. A high level of temperature resistance is one of the most important advantages of tungsten while the copper content increases the electrical and thermal conductivity. The cuw75 composite with 75 tungsten is widely used in chip carriers substrates flanges and frames for power semiconductor devices.

Thus they are often used as electrical contacts particularly in high voltage applications. Tungsten copper combines many typical characteristics of the single elements tungsten and copper as for example the hardness wear and burn off resistance of tungs ten together with the good electrical and thermal conductivity of copper. 3 show the thermal conductivity measurements of the w cu alloy with the recommended tprc value the thermal conductivity of tungsten was 174 w m k and that of copper was 401 w m k at room temperature and the measured thermal conductivity was between 179 w m k and 238 w m k depending on the copper content due to the higher thermal conductivity of copper the. Engineering thermal properties of metals conductivity thermal expansion specific heat data metals in general have high electrical conductivity high thermal conductivity and high density.

Tungsten copper heat sinks they are composites of tungsten and copper. Table 4 and fig. Contents of tungsten respectively copper can be selected. Copper infiltrated tungsten boasts such properties as high resistance to high temperature and arc erosion excellent thermal and electrical conductivity and a low cte coefficient of thermal.

Tungsten copper has unique material properties. The high thermal conductivity of copper together with the low thermal expansion of tungsten allows thermal expansion matching to silicon gallium arsenide and some ceramics. Consisting of pure tungsten w powder suspended in a matrix of copper cu these alloys are readily machinable and known for good thermal and electrical conductivity low thermal expansion being non magnetic good performance under vacuum and resistance to erosion from arcing.